Qualification and Performance Specification for Flexible Printed Boards
柔性印制电路板的品质和执行标准
Scope 适应范围
   执行级别：第二级
Covers qualification and performance requirements of flexible printed wiring. The flexible wiring may be:
   覆盖柔性印制电路品质和执行要求。柔性电路有：
Single sided 单面
Double sided 双面
Multilayer  多层
Rigid Flex   刚柔结合的

 Class 1  -   General Electronic Products
     第一级-普通电子产品
Includes consumer products, some computer and computer peripherals suitable for applications where cosmetic imperfections are not important and the major requirement is function of the completed electronics assembly.
包括这些产品：计算机和计算机表面次要的配套产品，主要是符合电子组装的功能。

  Class 2 C Dedicated Service Electronic Products
     第二级-精密的电子产品
Includes communications equipment, sophisticated business machines, and instruments where high performance and extended life is required and for which uninterrupted service is desired but not critical. Certain cosmetic imperfections are allowed.
包括通讯设备，精密的商业机器，这些设备要求寿命长，并且操作中不能中断，但是这些要求不是很严格的，也可以允许有一些较小的缺陷出现。

Class 3 C High Performance Electronics Products
     第三级-高精密的电子产品
Includes the equipment and products where continued performance or performance-on-demand is critical. Equipment downtime cannot be tolerated and must function when required. Assemblies in this class are suitable for applications where high levels of assurance are required, service is essential, or end-use environment may be uncommonly harsh.
包括那些持续工作和要求很高的产品，但它们工作是绝对不允许中断，在表面安装时也要保证很高的水准，因为这些产品可能应用在很恶劣的环境下。如军事和医疗设备。

3.0 Requirements 要求
3.3 Visual Examination目测
3.4 Dimension Requirements尺寸要求
3.5 Conductor Definition导体的清晰度
3.6 Physical Requirements物理要求
3.7 Structural Integrity (Cross-section diagram)结构完整性（ 切片视图）

3.3 Visual Examination目检
Defect: Open Circuit and Short Circuit
   缺陷:开路和短路

Causing Functional Failure. 导致功能失效
Is rejected.拒收

3.3 Visual Examination目检
3.3 Visual Examination目检
3.3 Visual Examination 目检

Defect: Projection and Island
   缺陷：板面突出物和孤岛
Shall not reduce conductor spacing by more than 30%. 不能减少电路间距的30%以上
       Example: Conductor spacing = 10 mils
      例如：电路间间距=10mils
      Conductor spacing > 70% of 10 mils
      电路间间距>10mils的70%
      Conductor spacing > 7 mils
      电路间间距>7mils
  

Foreign Inclusion Translucent particles
trapped within the board shall be acceptable.
板内夹杂的物体是透明的，可以接受。

3.3.2.10 Covercoat Requirement (Solder mask or Coverlay) 对表面覆盖物的要求（阻焊剂或覆盖膜）
1) Metal conductors shall not be exposed. (Exposed copper - Reject).
不能有金属导体暴露（露铜-拒收）
3.3.2.10.1.f BGA Land Misregistration BGA对位偏移
1) On BGA lands, if the land is solder-resist-defined, misregistration may allow a 900 breakout of the covercoat on the land.  在BGA区域，如果有覆盖膜的地方，允许有90度的破孔在表面覆盖膜上。
3.3.2.11 Solder Wicking/ Plating penetration   焊锡渗入/镀液渗入
a) Solder wicking shall not extend into bend or flex transition area.
     焊锡渗入不能延伸到弯曲和软板传递的地方  
b) Solder wicking shall not exceed limits :
     焊锡渗入的极限值
0.5 mm (20mils)
maximum.最大0.5mm(20mil)
Measure from coverlay
opening. 从覆盖膜开处测量起
3.3.2.12 Stiffener (Mechanical support)   补强板（机械支撑）
Void-free (no air bubble be trapped) bonding of the stiffener to the flexible printed wiring is not required.
   补强板粘到板上时对于气泡没有要求
Or或
Specific requirements shall be as agreed upon between user and supplier.
   除非供应商和使用者之间有特别的规定。
3.4 Dimensional    Requirement   尺寸要求
3.4.3 Annular Ring (external) C means the measurement of the annular ring on external layers is from the inside surface (within the hole) to outer edge of the annular ring on the surface of the flexible printed wiring.
    圆环形焊盘（外环）-板面外环宽度的测量法是从镀通孔或非镀通孔的孔壁量起。而非镀通孔的环宽则应自孔边向外测量到孔环的外缘为止，即为其环宽。
3.4.3 Annular Ring (External) 孔环（外环）
Shall meet requirements below:-
   要符合下面的要求：
A) Plated-through holes C 900 breakout of hole from land is allowed.
  镀通孔（用作导通）-允许有90度的破孔

3.4.3 Annular Ring (External) 孔环（外环）
Shall meet requirements below:-要符合下面的要求
A) Plated Through Hole :- For External Land, Land to trace junction- Conductor is not reduced by more than 30% of the minimum conductor width.
镀通孔-对于外部区域，从该区域到连接处，导体的减小最小不能超过导体宽度的30%
3.4.3 Annular Ring (External)   孔环（外部）
Shall meet requirements below:-要符合下面的要求
A) Plated Through Hole:- For external land, The conductor junctions should never be <50um (2 mils) or the minimum line width, whichever is smaller.
镀通孔-对于外部区域，导体的连接不能<50um（2mil)或最小线宽，其中较小者。
Annular Ring Breakout Defects 孔环破孔缺陷

3.5.3.6 Final Finish Coverage              最终处理膜之覆盖性
A) Solder coat over bare copper (tin-lead) shall be coverage and solderable.包着光铜（铅锡）的焊锡要有包覆性和可焊性
(No expose Cu is allowed on solder area.)
   在焊锡处不允许有露铜
3.5.3.3 Edge Conductor Lands 板边连接地
On gold finger area (insertion or contact area) shall be free of the following:  在金手指上（插入或连接区域）不能有下列情况出现：
A) Cut or scratches that expose nickel or copper.
  切口或刮伤导致露镍或露铜
B) Solder splash or tin-lead plating (Solder on gold)
  板面残留有溅锡颗粒或镀锡铅层（金面有焊锡）

3.5.3.4 Dewetting 缩锡
Acceptable C Class 2 接受-二级
On 5% or less of each land area for solder connection.
   焊锡连接区只允许有5%。
3.5.3.5 Nonwetting 拒锡
For tin, tin/lead reflowed, or solder coated surfaces, nonwetting is only permitted outside the minimum solderable area or annular ring requirement.
   凡作为焊锡连接功能之各种导体表面，如纯锡面，以熔融之锡铅面，焊锡皮膜面等均不允许出现“不沾锡”（拒锡）情形。